Type Unspecified

Type Unspecified

Current Projects

The world has witnessed an unprecedented increase in its energy requirements over the last few decades driven by the increasing size of the population, industrial development and the increasing level of activity of humans around the globe. Consequently, new paradigms are needed to produce clean and cheap energy.
As a first step towards realizing all inkjet printed electronics, this project aims at integrating conventional silicon based electronics with inkjet printed devices. This hybrid approach can result in reduction in cost of the systems as well as providing additional advantages like flexibility and 3-D implementation of electronic systems which are particularly suited to low cost and compact wireless sensor applications .        ​
​​Utilizing the low atmospheric absorption and inherent mm-wave radition at 94 GHz, a number of passive and active imaging applications have recently emerged. This project aims to develop mm-wave RF front end components in state of the art CMOS technology integrated with efficient passives in a compatible packaging environment.
Inkjet printed antennas and microwave devices on flexible and organic substrates, such as paper, have the advantages of being light weight, low cost, and environmentally friendly.  The applications of flexible microwave devices extend to low-cost RFID tags, lightweight wearable and sensing wireless devices, etc. ​​
The advances in metallic nanoparticles printing have enabled printing of electronics on substrates which are cheaper, lighter, thinner, environment friendly and suitable for flexible and conformal gadgets.​ Such a technology can be used to design wearable Tags for various applications such as outdoor and indoor tracking, RFIDs and others. ​ ​​​

Completed Projects

​A novel SoP design for automotive radar applications that employs, for the first time, a mixed LTCC tape system and integrates a fractal antenna array with a Fresnel lens to enhance the gain manifolds...
A miniature RF SoC is an ideal solution for many short-range wireless applications. Traditionally, sensors and antennas have been implemented off-the-chip requiring different integration and packaging methods to connect to circuits on-chip. However, this approach becomes excessively prohibitive at millimeter-wave frequencies such as 60 GHz due to transitions from one domain to another, resulting in degradation of system performance. Two projects are initiated targeting a complete SoC, however at different frequencies and for different applications. ...
A major bottleneck in true SoC implementation is efficient on-chip antenna realization due to its large size and silicon substrate losses. Emerging wireless applications at mm-wave frequencies (WPAN at 60 GHz, Automotive Radars at 77 GHz and passive imaging at 94 Ghz) require smaller antennas due to shorter wavelengths and thus has eased the integration of antennas with the circuits on the same chip. ​
​In this work, a novel System-in-Package (SiP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and package antennas at 5.2 GHz....
​In this work, a new floating-gate (FG) MOSFET based wireless dosimeter system-in-package (SiP) is presented. This miniature and completely integrated wireless dosimeter SiP comprises a CMOS FG radiation sensor and transmitter (TX) in a low-temperature co-fired ceramic (LTCC) package....
All integrated circuits (IC) have to be packaged. Typically these packages are mere holders of the IC. These ICs are then mounted on system boards that contain lots of components, like passives, interconnections, power sources, etc. The system on package (SoP), is a new approach that brings in functionality into the package by realizing passive components inside the package. It also helps in achieving high level system integration through vertically integrated components. Its ultimate goal is to integrate complete systems in a single, chip-sized package. One of the most important factors towards the complete SoP, is the introduction of new substrates that are more compatible with current circuit boards.
Low Temperature Co-fired Ceramic (LTCC) is a mature medium for SoP applications. Efficient passive elements can be designed in LTCC because of its low losses. The introduction of a high-dielectric constant ferrite material in the package not only helps to miniaturize the components but also permits the control of the devices made from it. Ferrite allows the properties of the package to be dynamically altered, meaning that the package will have the ability to control the signals that are passing through it. Therefore, ferrite LTCC is a perfect candidate for tunable passive elements. This SoP work is an attempt to push the package beyond merely providing embedded passives, wiring, and physical protection: the package itself becomes the device.